Title:
A POWER LED ENCAPSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2009/049453
Kind Code:
A1
Abstract:
A power LED encapsulation structure, comprising a heat sink (1), a circuit board,
a LED chip (3), inner leads (4) and an encapsulated colloid (8). The circuit board
has a counter bore (10), the heat sink (1) is inserted in the counter bore (10),
the LED chip (3) is placed on the heat sink (1), and the bottom of the heat sink (1)
directly contacts with the outer. The electrodes of the LED chip (3) are connected
to the interior metal electrodes (7) of the circuit board by the inner leads (4),
and the encapsulated colloid (8) covers the inner leads (4) and the LED chip (3).
Inventors:
YU BINHAI (CN)
LI JUNZHENG (CN)
XIA XUNLI (CN)
LI JUNZHENG (CN)
XIA XUNLI (CN)
Application Number:
PCT/CN2007/003740
Publication Date:
April 23, 2009
Filing Date:
December 24, 2007
Export Citation:
Assignee:
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD (CN)
YU BINHAI (CN)
LI JUNZHENG (CN)
XIA XUNLI (CN)
YU BINHAI (CN)
LI JUNZHENG (CN)
XIA XUNLI (CN)
International Classes:
F21V29/00; H01L23/367; H01L33/48; H01L33/64
Foreign References:
| CN2720646Y | 2005-08-24 | |||
| US20070007558A1 | 2007-01-11 | |||
| CN2852396Y | 2006-12-27 | |||
| US20020042156A1 | 2002-04-11 | |||
| CN2741195Y | 2005-11-16 | |||
| CN1635824A | 2005-07-06 | |||
| CN2812306Y | 2006-08-30 | |||
| CN1596049A | 2005-03-16 |
Attorney, Agent or Firm:
SCIHEAD PATENT AGENT CO., LTD. (Huihua Commercial & Trade BuildingNo.80, XianLie Zhong Road, Guangdong 0, CN)
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