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Title:
POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC CAR OR HYBRID CAR
Document Type and Number:
WIPO Patent Application WO/2017/094370
Kind Code:
A1
Abstract:
A power module apparatus (10) is provided with: a power module (100A) including a semiconductor device that performs power switching, a package (110) that seals the outer surrounding of the semiconductor device, and a radiator (42) joined to one surface of the package (110); and a cooling device (30) including a cooling water path (33) through which cooling water passes, the cooling water path (33) being provided with an opening portion (35) in the middle of the cooling water path (33) such that the radiator (42) of the power module (100A) is attached to the opening portion (35). The radiator (42) of the power module (100A) is attached to the opening portion (35) of the cooling water path (33) such that the height ha from the uppermost portion (33T) to the lowermost portion (33B) of the opening portion (35) of the cooling water path (33) is substantially equal to the height hb from the lowermost portion (33B) of the opening portion (35) of the cooling water path (33) to a base end portion (PB) opposite to the joined surface, of the radiator (42), relative to the package (110). Provided is a power module apparatus capable of efficiently cooling a power module configured to have a radiator attached to an opening portion formed in the upper surface portion of a cooling device, and of suppressing deterioration caused by overheat.

Inventors:
YOSHIHARA KATSUHIKO (JP)
SAITO MASAO (JP)
Application Number:
PCT/JP2016/080658
Publication Date:
June 08, 2017
Filing Date:
October 17, 2016
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; B60K11/02; H01L23/473; H01L25/18; H02M7/48; H05K7/20
Foreign References:
JP2014512678A2014-05-22
JP2012010540A2012-01-12
JP2006304522A2006-11-02
JP2005354000A2005-12-22
JP2006165534A2006-06-22
JP2012147564A2012-08-02
JP2005143151A2005-06-02
JPH10248198A1998-09-14
JP2009081273A2009-04-16
JPH08505985A1996-06-25
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
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