POWER MODULE AND POWER CONVERSION DEVICE

WIPO Patent Application WO/2023/022001

A1

Provided is a technique for enabling reduction of thermal stress due to bonding of a heat-dissipating member and an insulating substrate, and suppression of warping of the heat-dissipating member caused by the thermal stress. A power module (202) comprises: a heat-dissipating member (14) including a peripheral wall portion (15) and a recess portion (19) formed on the inner peripheral side of the peripheral wall portion (15) and recessed downward; at least one ceramic substrate (10) bonded inside the recess portion (19); a plurality of semiconductor elements mounted on the at least one ceramic substrate (10); a case (5) fixed along the upper end of the peripheral wall portion (15) and internally filled with a sealing resin (7); and a circuit forming member including electrode plates (63, 64, 65) respectively connecting between the plurality of semiconductor elements and between the semiconductor elements and the at least one ceramic substrate (10). The thickness of the peripheral wall portion (15) of the heat-dissipating member (14) in the vertical direction (Z-axis direction) is greater than the thickness of a bottom wall portion (16), forming a bottom surface of the recess portion (19), in the vertical direction (Z-axis direction).

FUJINO JUNJI (JP)
KAWAZOE CHIKA (JP)
TAKATA SHUHEI (JP)
IMOTO YUJI (JP)
WADA FUMIO (JP)

PCT/JP2022/029905

February 23, 2023

August 04, 2022

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MITSUBISHI ELECTRIC CORP (JP)

H01L25/07; H01L25/18; H02M7/48

JP2008277654A	2008-11-13
JP2013065836A	2013-04-11
JP2020072094A	2020-05-07

YOSHITAKE Hidetoshi et al. (JP)

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