Title:
POWER-MODULE DEVICE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/194023
Kind Code:
A1
Abstract:
This invention provides a power conversion device that has a case that: allows cooling devices and semiconductor components that contain semiconductor elements to be laid out in an alternating manner in order to cool said semiconductor elements from both sides; applies pressure to the cooling devices and semiconductor components laid out in an alternating manner and can be made less rigid in the direction in which said pressure is applied in order to eliminate gaps; and allows leak-free sealing even if a liquid silicon gel for ensuring pressure resistance is injected. Said power conversion device is provided with a case, the edges of which lie in essentially the same plane, that forms a shape that has a number of depressions equal to the number of semiconductor components to mount, said semiconductor components each containing a semiconductor element and a terminal. The semiconductor components are laid out in positions corresponding to the depressions in the case, the cooling devices are laid out so as to sandwich the semiconductor components with the case interposed therebetween, and a silicon gel is used to seal the semiconductor components.
Inventors:
TANIE HISASHI (JP)
SHINTANI HIROSHI (JP)
IDE EIICHI (JP)
NISHIHARA ATSUO (JP)
SHINTANI HIROSHI (JP)
IDE EIICHI (JP)
NISHIHARA ATSUO (JP)
Application Number:
PCT/JP2014/066368
Publication Date:
December 23, 2015
Filing Date:
June 20, 2014
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/28; H01L25/07; H01L23/427; H01L25/18; H05K7/20
Foreign References:
| JP2005237141A | 2005-09-02 | |||
| JPH0578608A | 1993-03-30 | |||
| JPS60195956A | 1985-10-04 | |||
| JP2011103395A | 2011-05-26 | |||
| JPS5698532A | 1981-08-08 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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