Title:
POWER MODULE AND INVERTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/006771
Kind Code:
A1
Abstract:
A power module (20) is provided with: a ceramic substrate (8); a semiconductor device (1) bonded in the vicinity of the central portion of a metal pattern (3) on the ceramic substrate (8); a ceramic frame (10) disposed along the edge of the area surrounding the metal pattern (3) on the ceramic substrate (8), the ceramic frame (10) surrounding the semiconductor device (1); and a resin layer (14) that includes the ceramic frame (10), the resin layer (14) sealing the semiconductor device (1) and the ceramic substrate (8). The ceramic frame (10) inhibits stress due to the difference between the linear thermal expansion coefficient of the ceramic substrate (8) and the linear thermal expansion coefficient of the semiconductor device (1). A power module is provided in which deterioration of the bonded portion can be inhibited, manufacture is simple, and reliability can be improved.
Inventors:
IWAHASHI SEITA (JP)
Application Number:
PCT/JP2016/068675
Publication Date:
January 12, 2017
Filing Date:
June 23, 2016
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/12; H01L23/29; H01L23/36; H01L25/18
Domestic Patent References:
| WO2015022994A1 | 2015-02-19 |
Foreign References:
| JP2014053441A | 2014-03-20 | |||
| JP2014053403A | 2014-03-20 | |||
| JP2014216459A | 2014-11-17 | |||
| JP2012231101A | 2012-11-22 | |||
| JPH08222658A | 1996-08-30 | |||
| JP2008263184A | 2008-10-30 | |||
| JP2004327732A | 2004-11-18 |
Other References:
See also references of EP 3321962A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
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