Title:
POWER MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/161437
Kind Code:
A1
Abstract:
Disclosed in the present invention are a power module and a manufacturing method therefor. The power module comprises: a power module body, comprising a circuit substrate and electronic components fixedly provided on the circuit substrate, the electronic components being electrically connected to circuit wirings of the circuit substrate; an epoxy plastic packaging layer, formed by plastic packaging of an epoxy plastic packaging material and covering the power module body; an anti-water absorption layer, formed by an anti-water absorption material and covering an outer surface of the epoxy plastic packaging layer; and a wiring pin, electrically connected to the circuit wirings of the circuit substrate and passing through the epoxy plastic packaging layer and the anti-water absorption layer in a sealing manner, and some of the wiring pin being exposed outside of the anti-water absorption layer. The technical solution of the present invention can reduce the water absorption property of the power module, improve moisture resistance property of the power module, and further improve service life of the power module.
Inventors:
WANG XINLEI (CN)
FENG YUXIANG (CN)
FENG YUXIANG (CN)
Application Number:
PCT/CN2017/085950
Publication Date:
September 13, 2018
Filing Date:
May 25, 2017
Export Citation:
Assignee:
GUANGDONG MIDEA REFRIGERATION APPLIANCES CO LTD (CN)
International Classes:
H01L23/29
Foreign References:
| CN105047623A | 2015-11-11 | |||
| CN103794576A | 2014-05-14 | |||
| CN105197879A | 2015-12-30 | |||
| US8023282B2 | 2011-09-20 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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