POWER MODULE AND MANUFACTURING METHOD THEREFOR

Title:

POWER MODULE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2021/001924

Kind Code:

A1

Abstract:

The present invention obtains a power module manufacturing method that can shorten the manufacturing time for a power module. This power module manufacturing method comprises: a subassembly positioning step in which a subassembly that has a first electrode, a semiconductor element, and a second electrode is placed on a heat sink with a bonding material interposed therebetween; and a transfer molding step in which, after the subassembly positioning step, a thermoplastic resin is injected into a region that is surrounded by the heat sink and a molding mold, with the first electrode, the semiconductor element, and an inside section of the second electrode positioned in said region. In the transfer molding step, due to the resin, the subassembly is bonded to the heat sink with the bonding material interposed therebetween.

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Inventors:

TANI MASAKAZU (JP)

Application Number:

PCT/JP2019/026294

Publication Date:

January 07, 2021

Filing Date:

July 02, 2019

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01L23/40; H01L21/56; H01L23/28; H01L23/29; H01L25/07; H01L25/18; H02M7/48

Foreign References:

JP2013030649A	2013-02-07
JP2010153639A	2010-07-08
JP2009212269A	2009-09-17
JP2008270297A	2008-11-06
JP2015099846A	2015-05-28
JP2005123495A	2005-05-12

Other References: