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Patent Searching and Data


Title:
POWER MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/001924
Kind Code:
A1
Abstract:
The present invention obtains a power module manufacturing method that can shorten the manufacturing time for a power module. This power module manufacturing method comprises: a subassembly positioning step in which a subassembly that has a first electrode, a semiconductor element, and a second electrode is placed on a heat sink with a bonding material interposed therebetween; and a transfer molding step in which, after the subassembly positioning step, a thermoplastic resin is injected into a region that is surrounded by the heat sink and a molding mold, with the first electrode, the semiconductor element, and an inside section of the second electrode positioned in said region. In the transfer molding step, due to the resin, the subassembly is bonded to the heat sink with the bonding material interposed therebetween.

Inventors:
TANI MASAKAZU (JP)
Application Number:
JP2019/026294
Publication Date:
January 07, 2021
Filing Date:
July 02, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/40; H01L21/56; H01L23/28; H01L23/29; H01L25/07; H01L25/18; H02M7/48
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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