POWER MODULE OF SQUARE FLAT PIN-FREE PACKAGING STRUCTURE

Title:

POWER MODULE OF SQUARE FLAT PIN-FREE PACKAGING STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2017/012329

Kind Code:

A1

Abstract:

A power module of a square flat pin-free packaging structure is used for suppressing the power module from being excessively high in local temperature. The power module comprises: insulating resin (1), a driving chip (31), power chips (30), and metal electrode contacts (20). The driving chip, the power chips, and the metal electrode contacts are electrically connected through a metal lead according to a specified design circuit. Metal heat dissipating disks (6) used for heat dissipation of the power chips and a driving chip lead frame (3) are disposed at the bottom of the insulating resin. Power chip lead frames (2) are disposed on the metal heat dissipating disks, the power chips are disposed on the power chip lead frames, and the drain electrodes of the power chips are electrically connected to the metal heat dissipating disks. The driving chips are disposed on the driving chip lead frames, and the metal heat dissipating disks extend beyond the area occupied by the driving chip lead frame and the metal electrode contacts at the bottom layer. Metal supporting pillars (4) are disposed below the driving chip lead frame, and the metal heat dissipating disks further extend into the bottom layer area below the driving chip lead frame.

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Inventors:

LIU SIYANG (CN)
WANG NING (CN)
WEI JIAHANG (CN)
LIU CHAO (CN)
SUN WEIFENG (CN)
LU SHENGLI (CN)
SHI LONGXING (CN)

Application Number:

PCT/CN2016/072692

Publication Date:

January 26, 2017

Filing Date:

January 29, 2016

Export Citation:

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Assignee:

UNIV SOUTHEAST (CN)

International Classes:

H01L23/495; H01L23/367; H01L25/16

Foreign References:

CN102569241B	2015-03-04
US20140097531A1	2014-04-10
US20120168922A1	2012-07-05
US20140117517A1	2014-05-01
CN105118818A	2015-12-02

Attorney, Agent or Firm:

NANJING JINGWEI PATENT & TRADEMARK AGENCY CO., LTD (CN)

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