Title:
POWER MODULE WITH TERMINAL BLOCK AND METHOD FOR MANUFACTURING POWER MODULE WITH TERMINAL BLOCK
Document Type and Number:
WIPO Patent Application WO/2016/199306
Kind Code:
A1
Abstract:
In order to reduce the length of wiring used in order to connect a terminal block and a semiconductor chip and obtain a highly reliable power module, this invention is provided with a resin-sealed power element 100 provided with a resin package 101 and a lead terminal led out from the resin package 101, a wiring board 200 on which the resin-sealed power element 100 is mounted, and a terminal block 300. The lead terminals of the resin-sealed power element 100 is provided with a first lead terminal 110 directly connected to the terminal block 300 and a second lead terminal 120 connected to the wiring board 200.
Inventors:
GOTO MASAKI (JP)
NAKAJIMA DAI (JP)
NAKAJIMA DAI (JP)
Application Number:
PCT/JP2015/067086
Publication Date:
December 15, 2016
Filing Date:
June 12, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/50; H01L25/18
Foreign References:
| JP2014036558A | 2014-02-24 | |||
| JP2014128066A | 2014-07-07 |
Attorney, Agent or Firm:
TAKAMURA, JUN (JP)
Jun Takamura (JP)
Jun Takamura (JP)
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