Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2013/105351
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a power module that reduces thermal resistance while maintaining insulation reliability. The present invention provides a power module that is characterized by being equipped with: a metallic cooling plate; an insulating layer that is formed on the metallic cooling plate and comprises an inorganic material which contains no resin component; metallic conductor plates that are bonded to the insulating layer via a resin layer; and a semiconductor device that is connected to the metallic conductor plate by means of a joining member.
Inventors:
NAOE KAZUAKI (JP)
SATO KEISHI (JP)
SATO KEISHI (JP)
Application Number:
PCT/JP2012/080668
Publication Date:
July 18, 2013
Filing Date:
November 28, 2012
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/12; H01L23/36; H01L23/48; H05K1/03; H05K1/05
Domestic Patent References:
| WO1994007263A1 | 1994-03-31 |
Foreign References:
| JPH11204724A | 1999-07-30 | |||
| JP2005012163A | 2005-01-13 | |||
| JP2005005638A | 2005-01-06 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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