Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/229822
Kind Code:
A1
Abstract:
A power module that: is formed by mounting an electronic component on a lead frame that has a plurality of leads; and performs power control. The power module comprises an electronic element that has a prescribed electrical function and is bonded to bonding surfaces of leads that face in a direction that is orthogonal to a plate-thickness direction. The bonding surfaces of the leads and bonding surfaces of the electronic element that is bonded to the bonding surfaces of the leads have different areas.
Inventors:
OIKAWA TAKAHIRO (JP)
Application Number:
PCT/JP2017/021618
Publication Date:
December 20, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H01L25/07; G01R15/00; H01C13/00; H01L23/48; H01L25/18
Domestic Patent References:
| WO2015115596A1 | 2015-08-06 |
Foreign References:
| JP2009182022A | 2009-08-13 | |||
| US20050173783A1 | 2005-08-11 | |||
| JPH06216308A | 1994-08-05 | |||
| JP2017005204A | 2017-01-05 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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