Title:
POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2022/005183
Kind Code:
A1
Abstract:
The present invention relates to a power module comprising: a lower ceramic substrate (200) including a ceramic base material (201) and metal layers (202, 203) formed on the top surface and the bottom surface of the ceramic base material (201); a heat-dissipation plate (500) bonded to the bottom surface of the lower ceramic substrate (200); and a solder preform layer (550) disposed between and bonded to the bottom surface of the lower ceramic substrate (200) and the top surface of the heat-dissipation plate (500). The present invention has the following advantageous effects: the entrapment of volatile material is minimized due to the solder preform used when the heat-dissipation plate and the ceramic substrate are bonded to each other, thereby preventing air bubble generation; and the high-temperature reliability can be improved due to the Sb based-solder used as the solder preform.
Inventors:
CHO TAEHO (KR)
YEO INTAE (KR)
BIN JINHYUCK (KR)
PARK SEUNGGON (KR)
LEE JIHYUNG (KR)
YEO INTAE (KR)
BIN JINHYUCK (KR)
PARK SEUNGGON (KR)
LEE JIHYUNG (KR)
Application Number:
PCT/KR2021/008216
Publication Date:
January 06, 2022
Filing Date:
June 30, 2021
Export Citation:
Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01L23/373; H01L23/00; H01L23/13; H01L23/15; H01L23/29; H01L23/482; H05K1/03; H05K7/20
Foreign References:
| KR20140142256A | 2014-12-11 | |||
| KR20180056762A | 2018-05-29 | |||
| KR101379437B1 | 2014-04-04 | |||
| KR20000007321A | 2000-02-07 | |||
| KR20150108363A | 2015-09-25 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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