Title:
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/085006
Kind Code:
A1
Abstract:
The present invention addresses the problem that adhesion of a power semiconductor device to a heat dissipation surface is inadequate and heat dissipation performance is reduced. A heat conduction layer 5 is brought into contact with a heat dissipation surface 4a of a circuit body 100, and a heat dissipation member 7 is brought into contact with the heat-dissipation-surface 4a side of the circuit body 100, which is the outer side of the heat conduction layer 5. A fixed member 8 is brought into contact with the side of the circuit body 100 that is the side opposite from the heat dissipation surface 4a. A connection member 9 is passed through the ends of each of the heat dissipation member 7 and the fixed member 8. Fig. 3 shows the state before a bolt of the connection member 9 and a nut are fastened. The heat dissipation member 7 maintains a curved shape so that the center portion thereof is convex toward the circuit body 100. The bolt of the connection member 9 and the nut are fastened and secured at both ends of the heat dissipation member 7 and the fixed member 8 so as to sandwich the circuit body 100. The heat dissipation member 7 is elastically deformed, the heat dissipation member 7 is affixed to the heat dissipation surface 4a of the circuit body 100 via the heat conduction layer 5, and surface pressure is applied from the heat dissipation member 7 to the heat dissipation surface 4a.
Inventors:
SHIMAZU HIROMI (JP)
KANEKO YUJIRO (JP)
IDE EIICHI (JP)
TAKAGI YUSUKE (JP)
TANIE HISASHI (JP)
KANEKO YUJIRO (JP)
IDE EIICHI (JP)
TAKAGI YUSUKE (JP)
TANIE HISASHI (JP)
Application Number:
PCT/JP2020/036784
Publication Date:
May 06, 2021
Filing Date:
September 29, 2020
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/40; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| WO2018146933A1 | 2018-08-16 |
Foreign References:
| JP2014203892A | 2014-10-27 | |||
| JP2004363521A | 2004-12-24 | |||
| JP2019047049A | 2019-03-22 | |||
| JP2016082234A | 2016-05-16 | |||
| JP2011129739A | 2011-06-30 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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