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Title:
POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/031317
Kind Code:
A1
Abstract:
This power semiconductor device comprises power semiconductor sealed bodies, film capacitors, coolers, and a partitioning wall member (thin plate case) for housing the power semiconductor sealed bodies, film capacitors, and coolers. Each power semiconductor sealed body comprises a power semiconductor element having two main surfaces and a heat dissipation plate which is on at least one of the main surfaces of the power semiconductor element via bonding material and is used to dissipate heat from the power semiconductor element, and each power semiconductor sealed body is configured by sealing with an insulating resin at least the power semiconductor element and the bonding surface between the heat dissipation plate and the power semiconductor element. This power semiconductor device is characterized in that the partitioning wall member has a plurality of open portions above and below, the power semiconductor sealed bodies and the film capacitors are housed in each of the open portions having an opening on the upper side of the partitioning wall member, and coolers are housed in each of the open portions having an opening on the lower side such that the power semiconductor sealed bodies and the film capacitors are disposed with coolers therebetween.

Inventors:
KUSUKAWA Junpei (6-6, Marunouchi 1-chome, Chiyoda-k, Tokyo 80, 〒1008280, JP)
NAKATSU Kinya (6-6, Marunouchi 1-chome, Chiyoda-k, Tokyo 80, 〒1008280, JP)
IDE Eiichi (6-6, Marunouchi 1-chome, Chiyoda-k, Tokyo 80, 〒1008280, JP)
OONISHI Masami (6-6, Marunouchi 1-chome, Chiyoda-k, Tokyo 80, 〒1008280, JP)
Application Number:
JP2015/064397
Publication Date:
March 03, 2016
Filing Date:
May 20, 2015
Export Citation:
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Assignee:
HITACHI, LTD. (6-6 Marunouchi 1-chome, Chiyoda-ku Tokyo, 80, 〒1008280, JP)
International Classes:
H01L25/07; H01G2/08; H01G2/10; H01G4/224; H01L23/40; H01L23/473; H01L25/18
Domestic Patent References:
WO2013094028A12013-06-27
Foreign References:
JP2005237141A2005-09-02
JP2001320005A2001-11-16
JP2010258315A2010-11-11
JP2001352023A2001-12-21
JP2010119299A2010-05-27
JP2014116400A2014-06-26
Other References:
See also references of EP 3188232A4
Attorney, Agent or Firm:
INOUE Manabu et al. (6-1, Marunouchi 1-chome, Chiyoda-k, Tokyo 20, 〒1008220, JP)
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