POWER SEMICONDUCTOR MODULE, ELECTRONIC COMPONENT AND METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE

WIPO Patent Application WO/2018/194153

A1

Provided is a power semiconductor device which is capable of suppressing ringing that occurs during a switching operation of a switching element, and which has high reliability. A power semiconductor module according to the present invention is provided with: a semiconductor element (204); conductor patterns (203a, 203d-203f); a snubber circuit; a sealing body (205); a metal terminal (306b) that functions as an intermediate member; and a solder bonding part (211) that functions as a bonding material. The semiconductor element (204) is connected to the conductor patterns (203a, 203d-203f). The snubber circuit (106) is a circuit wherein a capacitor main body part (306a) and a resistor (210) are connected in series with each other. The sealing body (205) seals the semiconductor element (204), the conductor patterns (203a, 203d-203f, 203h), the capacitor main body part (306a) and the resistor (210). The metal terminal (306b), which is connected to the capacitor main body part (306a), is connected to the conductor patterns (203e, 203f) by means of the solder bonding part (211).

YANAGIMOTO TATSUNORI (JP)
HORIGUCHI TAKESHI (JP)
NAKAHARA KENTA (JP)
MIYAZAKI YUJI (JP)
SHIMIZU YASUTAKA (JP)

PCT/JP2018/016263

October 25, 2018

April 20, 2018

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MITSUBISHI ELECTRIC CORP (JP)

H01L25/07; H01G4/228; H01G4/30; H01L23/29; H01L23/31; H01L23/34; H01L25/00; H01L25/18; H02M7/48

WO2014097798A1

2014-06-26

JP2009225612A	2009-10-01
JP2012210153A	2012-10-25
JP2015126342A	2015-07-06
JP2010123614A	2010-06-03
JPH0529108U	1993-04-16
JPS6315034U	1988-02-01
JPS6151952A	1986-03-14

FUKAMI PATENT OFFICE, P.C. (JP)

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