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Patent Searching and Data


Title:
POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SINTERED POWER SEMICONDUCTOR MODULE HAVING A TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2012/062274
Kind Code:
A3
Abstract:
The invention relates to a method for producing electrical components that can be sintered, for jointly sintering with active components, wherein the components having a planar shape are provided with at least one flat lower face intended to be sintered, and an electrical contact area on the surface opposite the sintering surface is present in the form of a metal contact surface, which can be contacted at the top face by a common method from the following group: wire bonding or soldering or sintering or pressure contacting, wherein the component is a temperature sensor, on the lower face of which a metallization that can be sintered is provided on a ceramic body and on the ceramic body of which two electrical contact surfaces are provided for continuative electrical connection.

Inventors:
EISELE RONALD (DE)
Application Number:
PCT/DE2011/001905
Publication Date:
July 26, 2012
Filing Date:
October 28, 2011
Export Citation:
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Assignee:
DANFOSS SILICON POWER GMBH (DE)
EISELE RONALD (DE)
International Classes:
H01L23/15; G01K7/18; H01L23/34
Foreign References:
JPH04102365A1992-04-03
DE102007046900A12009-04-30
EP2042260A22009-04-01
DE10122363A12002-11-28
US20090140369A12009-06-04
EP0809094A11997-11-26
EP1286144A12003-02-26
US5896081A1999-04-20
Attorney, Agent or Firm:
BIEHL, Christian (Schlieffenallee 5, Kiel, DE)
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