Title:
POWER SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2015/004990
Kind Code:
A1
Abstract:
Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14), and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10), said end portions being on the side bonded to the solder (4).
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Inventors:
WATARI SHINJIRO (JP)
KOKUBUN SHUICHI (JP)
YAMADA TAKESHI (JP)
HARADA TSUYOSHI (JP)
KOKUBUN SHUICHI (JP)
YAMADA TAKESHI (JP)
HARADA TSUYOSHI (JP)
Application Number:
PCT/JP2014/063015
Publication Date:
January 15, 2015
Filing Date:
May 16, 2014
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L25/18; H01L25/07
Foreign References:
| JPH05160339A | 1993-06-25 | |||
| JPH11177017A | 1999-07-02 | |||
| JPH05167002A | 1993-07-02 | |||
| JP2006310523A | 2006-11-09 | |||
| JP2010063242A | 2010-03-18 | |||
| JPH0547989A | 1993-02-26 |
Other References:
See also references of EP 3021358A4
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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