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Patent Searching and Data


Title:
POWER SUPPLY SYSTEM AND SEMICONDUCTOR PACKAGE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/063720
Kind Code:
A1
Abstract:
An electronic device and a semiconductor package structure are provided. The electronic device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The plurality of semiconductor dies are stacked over the power supply system, and the power supply system includes: a voltage generating circuit configured to generate at least one voltage; and a die enabling circuit configured to generate a die enable signal according to the at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies through a power interconnecting structure, and the die enable signal is configured to enable synchronous input of the at least one voltage to the plurality of semiconductor dies.

Inventors:
NING SHU-LIANG (CN)
Application Number:
PCT/CN2019/108056
Publication Date:
April 02, 2020
Filing Date:
September 26, 2019
Export Citation:
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Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C5/14; G11C11/4074; H01L25/16; H01L25/18
Foreign References:
CN109147834A2019-01-04
CN109147835A2019-01-04
US20120250443A12012-10-04
US20080205183A12008-08-28
US9722597B22017-08-01
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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