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Title:
PRE-FORMED THERMOPLASTIC FILLER FOR THERMOSET STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/089340
Kind Code:
A3
Abstract:
An apparatus includes a first thermoset layer (24A, 124A) that includes a first fibrous material embedded in a first thermoset matrix. The apparatus also includes a second thermoset layer (24B, 124B) that includes a second fibrous material embedded in a second thermoset matrix. The second thermoset layer (24B, 124B) is coupled to the first thermoset layer (24A, 124A) to form a joint (20, 120). Further, a gap (28, 128) is defined between the first thermoset layer (24A, 124A) and the second thermoset layer (24B, 124B). The apparatus also includes a thermoplastic filler (26, 126) that is made from a thermoplastic material. The thermoplastic filler (26, 126) is positioned within the gap (28, 128).

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Inventors:
FORSTON GABRIEL Z (US)
HARRIS CHRISTOPHER G (US)
TYNDALL JOSHUA P (US)
KWON HYUKBONG (US)
SCHMIDT CAROLYN (US)
Application Number:
PCT/US2014/043676
Publication Date:
August 04, 2016
Filing Date:
June 23, 2014
Export Citation:
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Assignee:
BOEING CO (US)
International Classes:
B29C65/02; B29C70/08; B32B3/06; B32B5/26; B32B7/04; B64C1/06; B64C1/12; B29K101/10; B29K105/06; B29K307/04; B29L31/30
Domestic Patent References:
WO2010144007A12010-12-16
Foreign References:
US5919543A1999-07-06
EP2052846A12009-04-29
Attorney, Agent or Firm:
WOO, Euclid et al. (5301 Bolsa AvenueMC H011-B17, Seal Beach California, US)
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