PRE-IMPREGNATED MATERIAL USED FOR CIRCUIT SUBSTRATE, LAMINATED BOARD, PREPARATION METHOD THEREFOR, AND PRINTED CIRCUIT BOARD COMPRISING SAME

WIPO Patent Application WO/2018/120488

A1

A pre-impregnated material used for a circuit substrate. The pre-impregnated material comprises a pre-impregnated core material layer and an outer resin layer formed on at least one side of the pre-impregnated core material layer; the pre-impregnated core material layer comprises a reinforcing material and an inner resin layer wrapped on the outside of the reinforcing material. The dielectric constant of the outer resin layer is denoted as Dkouter, and the thickness is denoted as Houter; the dielectric constant of the pre-impregnated core material layer is denoted as Dkcore, and the thickness is denoted as Hcore; and the dielectric constant of a laminated board Dklaminated board satisfies the following condition: Dkpre-impregnated material ＝ (Dkcore × Hcore + Dkouter × Houter) / (Hcore + Houter). According to differences between Dk and thickness of the pre-impregnated core material and the outer resin layer, Dk value of the laminated board is calculated on the basis of the weight of the thickness, and the designability of Dk of the laminated board is realized. In addition, the design range of Dk of the laminated board is not limited to Dk of the reinforcing material, solving the problem of PCB design difficulties.

CHEN HU (CN)

PCT/CN2017/079421

July 05, 2018

April 05, 2017

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SHENGYI TECHNOLOGY CO LTD (CN)

B32B15/08; C08J5/24; B32B15/092; B32B15/20; B32B17/02; B32B17/10; B32B27/04; B32B27/06; B32B27/28; B32B27/38; H05K1/03

CN105705558A	2016-06-22
CN103755989A	2014-04-30
CN102958984A	2013-03-06
CN101795859A	2010-08-04
CN105694451A	2016-06-22

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