Title:
PRE-LOADING CHAMBER AND SEMICONDUCTOR PROCESSING PLATFORM
Document Type and Number:
WIPO Patent Application WO/2022/063052
Kind Code:
A1
Abstract:
Disclosed are a pre-loading chamber and a semiconductor processing platform. The pre-loading chamber comprises a chamber body and a wafer support, wherein the chamber body is provided with an accommodating cavity, and the wafer support is located in the accommodating cavity. The wafer support comprises a plurality of bearing tables that are used for bearing wafers and are arranged at intervals in a vertical direction, a support body connected to the plurality of bearing tables, and a fixing member, wherein at least one of the plurality of bearing tables is located above the support body, and is provided with a yielding portion that allows the fixing member to pass therethrough, and the fixing member is used for fixedly connecting the support body to the chamber body. The solution can solve the problem of low wafer transmission efficiency.
Inventors:
MA LIANG (CN)
Application Number:
PCT/CN2021/119014
Publication Date:
March 31, 2022
Filing Date:
September 17, 2021
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/677; H01L21/67; H01L21/687
Foreign References:
| CN1937197A | 2007-03-28 | |||
| CN208832599U | 2019-05-07 | |||
| CN112151431A | 2020-12-29 | |||
| CN202898519U | 2013-04-24 | |||
| CN104795347A | 2015-07-22 | |||
| CN105742205A | 2016-07-06 | |||
| US20080118236A1 | 2008-05-22 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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