Title:
PRE-MEASUREMENT PROCESSING METHOD, EXPOSURE SYSTEM AND SUBSTRATE PROCESSING EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2005/083756
Kind Code:
A1
Abstract:
[PROBLEMS] To highly efficiently manufacture high-performance and high-quality micro devices at a high throughput. [MEANS FOR SOLVING PROBLEMS] Prior to carrying in a wafer W to exposure equipment (200) which is to expose the wafer W, a mark formed on the wafer W is measured by inline measuring equipment (400), and the exposure equipment (200) is informed of the measurement results and/or results obtained by calculating the measurement results. The exposure equipment (200) optimizes measuring conditions based on the informed results, and then perform processes such as alignment.
Inventors:
ISHII YUUKI (JP)
SUZUKI HIROYUKI (JP)
OKITA SHINICHI (JP)
SUZUKI HIROYUKI (JP)
OKITA SHINICHI (JP)
Application Number:
PCT/JP2005/003156
Publication Date:
September 09, 2005
Filing Date:
February 25, 2005
Export Citation:
Assignee:
NIKON CORP (JP)
ISHII YUUKI (JP)
SUZUKI HIROYUKI (JP)
OKITA SHINICHI (JP)
ISHII YUUKI (JP)
SUZUKI HIROYUKI (JP)
OKITA SHINICHI (JP)
International Classes:
G03F9/00; H01L21/027; (IPC1-7): H01L21/027; G03F9/00
Foreign References:
| JPH02170515A | 1990-07-02 | |||
| JPS6276622A | 1987-04-08 |
Attorney, Agent or Firm:
Maeda, Hitoshi (2F Tokyodo Jinboucho 3rd Bldg., 1-17,
Kandajinboucho 1-chom, Chiyoda-ku Tokyo 51, JP)
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