Title:
PRE-PREG, LAMINATE BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/101991
Kind Code:
A1
Abstract:
This pre-preg (40) is formed by impregnating a woven fiber constituted of strands with a resin composition. In this pre-preg, silica particles are present in the strands. This makes it possible to obtain a pre-preg having a superior ability for woven fiber to be impregnated with the resin composition. It is further possible to use this pre-preg and/or a metal-clad laminate board produced using this pre-preg to produce a printed wiring board and a semiconductor device.
Inventors:
OHIGASHI NORIYUKI (JP)
Application Number:
PCT/JP2012/000316
Publication Date:
August 02, 2012
Filing Date:
January 19, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
OHIGASHI NORIYUKI (JP)
OHIGASHI NORIYUKI (JP)
International Classes:
B32B5/28; C08J5/24; B32B15/08; C08J5/08; C08K3/36; H05K1/03
Foreign References:
| JP2006036916A | 2006-02-09 | |||
| JP2003213021A | 2003-07-30 | |||
| JP2001038836A | 2001-02-13 | |||
| JPH091680A | 1997-01-07 | |||
| JP2005105035A | 2005-04-21 | |||
| JPH061605A | 1994-01-11 | |||
| JP2011202140A | 2011-10-13 | |||
| JPH09209233A | 1997-08-12 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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Claims: