Title:
PREFABRICATED AND ATTACHED INTERCONNECT STRUCTURE
Document Type and Number:
WIPO Patent Application WO2004100218
Kind Code:
B1
Abstract:
A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachement each interconnect structure is combined with and/or held in a carrier structure fromm which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.
Inventors:
KISTER JANUARY
BEATSON DAVID
LAURENT EDWARD
BEATSON DAVID
LAURENT EDWARD
Application Number:
PCT/US2004/012452
Publication Date:
July 21, 2005
Filing Date:
April 23, 2004
Export Citation:
Assignee:
K & S INTERCONNECT INC (US)
International Classes:
G01R1/073; (IPC1-7): H01R12/00; G01R31/02; H01L23/02; H01R27/00; H01R43/00
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