Title:
PRELOAD-TYPE PROBE HEAD
Document Type and Number:
WIPO Patent Application WO/2023/153556
Kind Code:
A1
Abstract:
The present invention relates to a probe head for testing semiconductor elements, the central technical feature being a preload-type probe head comprising: a probe having a stopper; and a block having a coupling hole into which the probe is coupled, wherein a guide film having an open area to expose the coupling hole is provided on top of the block, and a lower part under the open area is formed to be wide relative to the upper part to thus provide a flexible area, due to the guide film, between the probe stopper and the block. Accordingly, multiple guide films on top of the block form thereon flexible spaces that correspond to the pressed part of the probe stopper, thereby providing the benefit of reducing the impact received by the block during semiconductor element testing.
Inventors:
AN SEUNG BAE (KR)
JU YOUNG HUN (KR)
JU YOUNG HUN (KR)
Application Number:
PCT/KR2022/004443
Publication Date:
August 17, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
TSE CO LTD (KR)
International Classes:
G01R1/067; G01R31/28
Domestic Patent References:
| WO2021023739A1 | 2021-02-11 |
Foreign References:
| KR20210119814A | 2021-10-06 | |||
| KR20170092523A | 2017-08-11 | |||
| KR20150031371A | 2015-03-24 | |||
| JP2013148500A | 2013-08-01 |
Attorney, Agent or Firm:
LEE, Joon Sung (KR)
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