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Patent Searching and Data


Title:
PREPARATION METHOD FOR LED PACKAGE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/206333
Kind Code:
A1
Abstract:
A preparation method for an LED package substrate. The LED package substrate comprises: a package substrate used for protecting and bearing an LED chip; a reflective layer located on the package substrate; a light conversion layer located on the reflective layer; a package substrate-free LED chip located on the light conversion layer, said chip being capable of bidirectionally emitting light having a specific wavelength. The package substrate includes the light conversion layer, thereby simplifying a package process. The preparation process is advantageous for the large-batch preparation of package substrates containing a uniform fluorescent powder, and increases product yield and production.

Inventors:
ZHAO, Long (Room 2801, North of Bai Hui Bldg No. 3019 SunGang East Road, LuoHu Dist, Shenzhen Guangdong 0, 518000, CN)
Application Number:
CN2016/094072
Publication Date:
December 07, 2017
Filing Date:
August 09, 2016
Export Citation:
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Assignee:
SHENZHEN CHAO WEIDA TECHNOLOGY CO., LTD (Room 2801, North of Bai Hui Bldg No. 3019 SunGang East Road, LuoHu Dist, Shenzhen Guangdong 0, 518000, CN)
International Classes:
H01L33/50; H01L33/48
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