Title:
PREPARATION METHOD FOR MICRONEEDLE PATCH
Document Type and Number:
WIPO Patent Application WO/2022/142369
Kind Code:
A1
Abstract:
A preparation method for a microneedle patch. The method comprises the following steps: (1) milling a base into a master mold containing microneedles; (2) performing surface treatment on the master mold to obtain a processed master mold; (3) molding on a surface of the treated master mold, curing same, and obtaining a cured sub-mold after demolding; (4) casting a modification solution on a surface of the sub-mold, and obtaining a microneedle patch after drying and curing. The preparation method for a microneedle patch can decrease processing difficulty, reduce processing costs and time, and also prepare microneedle molds having different high-to-bottom ratios, areas and shapes according to requirements, and mold same into microneedle patches.
More Like This:
Inventors:
LIU CHANGSHENG (CN)
HE HONGYAN (CN)
JIN LILI (CN)
ZHANG DIAN (CN)
HE HONGYAN (CN)
JIN LILI (CN)
ZHANG DIAN (CN)
Application Number:
PCT/CN2021/113007
Publication Date:
July 07, 2022
Filing Date:
August 17, 2021
Export Citation:
Assignee:
UNIV EAST CHINA SCIENCE & TECH (CN)
International Classes:
A61M37/00; B23P15/00
Domestic Patent References:
| WO2017007156A1 | 2017-01-12 |
Foreign References:
| CN112569465A | 2021-03-30 | |||
| CN105126243A | 2015-12-09 | |||
| CN104703651A | 2015-06-10 | |||
| CN103568160A | 2014-02-12 | |||
| CN104844814A | 2015-08-19 | |||
| CN111544758A | 2020-08-18 |
Attorney, Agent or Firm:
XU&PARTNERS, LLC. (CN)
Download PDF: