PREPARATION PROCESS FOR POLYIMIDE-ALUMINUM COMPOSITE FOIL

WIPO Patent Application WO/2023/236572

A1

The present invention relates to a preparation process for a polyimide-aluminum composite foil, comprising the following steps: an aluminum foil heat treatment stage, an aluminum foil cooling stage, an etched foil preparation stage, a reamed foil preparation stage, a polyimide composite layer preparation stage, a surface cleaning stage, and a drying treatment stage. In the polyimide composite layer preparation stage, a pre-treatment solution used is formed by mixing 4,4'-diaminodiphenyl ether, N,N-dimethylacetamide, and tetrahexylammonium benzoate, and a post-treatment solution used is formed by mixing sulfuric acid, hydrochloric acid, 4,4'-diaminodiphenyl ether, N,N-dimethylacetamide, and tetrahexylammonium benzoate. In this way, a polyimide composite layer formed can be stably attached to the outer surface of an etched foil, so that the bending strength of an electrode foil is improved; and the polyimide composite layer filled in an etched pore channel can be tightly combined with an aluminum residual core together, thereby ensuring that the formed electrode foil has relatively high dielectric constant and capacitance.

WANG JIANZHONG (CN)
ZHU WEICHEN (CN)
PU YU (CN)
CHENG HENGYANG (CN)
HE GUILI (CN)
YAN KANGPING (CN)
WANG GUIXIN (CN)

PCT/CN2023/075321

December 14, 2023

February 10, 2023

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NANTONG HAIXING ELECTRONICS LLC (CN)
NANTONG HAIYI ELECTRONICS CO LTD (CN)
SI CHUAN ZHONGYA TECH COMPANY (CN)

H01G9/055

CN114724859A	2022-07-08
CN1533886A	2004-10-06
JP2009010330A	2009-01-15
CN109023248A	2018-12-18
CN110385241A	2019-10-29

NANJING ZHENGLIAN INTELLECTUALPROPERTY AGENCY CO., LTD. et al. (CN)

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