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Patent Searching and Data


Title:
PREPREG FOR BUILD-UP
Document Type and Number:
WIPO Patent Application WO/2012/124307
Kind Code:
A1
Abstract:
This prepreg (1) for build-up is provided with a fiber substrate (2) and with a resin layer provided on both sides thereof. Conforming to IPC-TM-650 Method 2.3.17, the resin flow of the prepreg measured after heating and pressing for 5 minutes under conditions of 171±3°C and 1380±70kPa is not less than 15 weight% and not greater than 50 weight%.

Inventors:
ENDO TADASUKE (JP)
MITSUI YASUAKI (JP)
Application Number:
PCT/JP2012/001685
Publication Date:
September 20, 2012
Filing Date:
March 12, 2012
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
ENDO TADASUKE (JP)
MITSUI YASUAKI (JP)
International Classes:
H05K3/46; B32B15/08; B32B27/12; H05K1/03
Foreign References:
JP2003342399A2003-12-03
JPH09501724A1997-02-18
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
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Claims: