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Patent Searching and Data


Title:
PREPREG, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/031249
Kind Code:
A1
Abstract:
Provided is a prepreg, wherein same is a blend of a fiber reinforcement, a matrix resin and a filler, with the fiber reinforcement being 20-60 parts by mass, the matrix resin being 20-65 parts by mass, and the filler being 10-40 parts by mass, wherein the filler is flame retardant organic microspheres or a blend of flame retardant organic microspheres and an inorganic filler, and the particle size of the filler is 0.1 micrometers to 15 micrometers. Also provided are a copper clad laminate and a printed circuit board prepared using the prepreg of the present invention. Compared with the related technologies, the prepreg of the present invention has good interfacial properties and stable material properties, and the production process therefor is simple and the production efficiency thereof is high. Moreover, the copper clad laminate and the printed circuit board of the present invention have stable properties and low production costs.

Inventors:
WANG HONGYUAN (CN)
WANG HEZHI (CN)
ZHANG YILAN (CN)
Application Number:
PCT/CN2019/104826
Publication Date:
February 25, 2021
Filing Date:
September 09, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECH NANJING CO LTD (CN)
International Classes:
B32B15/20; C08L71/12; C08L25/02
Foreign References:
CN110591241A2019-12-20
CN109852031A2019-06-07
CN105936745A2016-09-14
US20180051170A12018-02-22
US20060177666A12006-08-10
Attorney, Agent or Firm:
GUAGDONG GUANGHE LAW FIRM (CN)
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