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Title:
PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/181514
Kind Code:
A1
Abstract:
Provided are: a prepreg for a coreless substrate, which is able to satisfy heat resistance, low thermal expansion and bonding strength to a metal circuit at high levels required for coreless substrates; and a coreless substrate and a semiconductor package, each of which uses this prepreg for a coreless substrate. Specifically, this prepreg for a coreless substrate contains a thermosetting resin composition that contains (a) dicyandiamide, (b) an addition product of a tertiary phosphine and a quinone, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two N-substituted maleimide groups. In place of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound having at least two N-substituted maleimide groups, an amino-modified polyimide resin (X), which is obtained by reacting the amine compound and the maleimide compound with each other, may be used.

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JP4253529Thermosetting resin composition, prepreg and substrate using it
Inventors:
YOKOTA HIROSHI (JP)
HASHIMOTO SHINTARO (JP)
SAKAMOTO NORIHIKO (JP)
TSUCHIKAWA SHINJI (JP)
NAWATE KATSUHIKO (JP)
TAKANEZAWA SHIN (JP)
Application Number:
PCT/JP2018/012844
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08J5/24; C08G73/12; H05K1/03; H05K3/46
Domestic Patent References:
WO2006001445A12006-01-05
Foreign References:
JP2012045887A2012-03-08
JP2015224304A2015-12-14
JP2015224303A2015-12-14
JP2014024927A2014-02-06
JP2014024925A2014-02-06
JPH05230242A1993-09-07
JP2017075221A2017-04-20
JP2018012791A2018-01-25
JP2018012764A2018-01-25
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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