PREPREG, AND LAMINATE BOARD AND PRINTED WIRING BOARD USING SAME

WIPO Patent Application WO/2012/099131

A1

A prepreg including a fiber base material and a thermosetting resin composition layer, characterized in that the thermosetting resin composition layer contains a compound having a modified silicone oil or a skeleton derived from a modified silicone oil and in that said thermosetting resin composition layer has a phase separation structure. The present invention is capable of providing a prepreg having low heat expansion and excellent warping characteristics which are difficult to achieve through only conventional methods such as high filling with an inorganic filler material or use of a resin with a low thermal expansion coefficient; the present invention is also capable of providing a laminate board and a printed wiring board using said prepreg.

KOTAKE TOMOHIKO (JP)
MIYATAKE MASATO (JP)
NAGAI SHUNSUKE (JP)
IZUMI HIROYUKI (JP)
TSUCHIKAWA SHINJI (JP)
TAKANEZAWA SHIN (JP)
MURAI HIKARI (JP)

PCT/JP2012/050875

July 26, 2012

January 17, 2012

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HITACHI CHEMICAL CO LTD (JP)
KOTAKE TOMOHIKO (JP)
MIYATAKE MASATO (JP)
NAGAI SHUNSUKE (JP)
IZUMI HIROYUKI (JP)
TSUCHIKAWA SHINJI (JP)
TAKANEZAWA SHIN (JP)
MURAI HIKARI (JP)

C08J5/24; H05K1/03

JPH07148885A	1995-06-13
JPH0693103A	1994-04-05
JPH05105778A	1993-04-27
JPH07150042A	1995-06-13
JP2000071385A	2000-03-07
JPS62158716A	1987-07-14
JPH05148343A	1993-06-15
JP2740990B2	1998-04-15
JP2904311B2	1999-06-14
JP4591801B2	2010-12-01
JP2000243864A	2000-09-08
JP2000114727A	2000-04-21

OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)

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