Title:
PREPREG, LAMINATED BOARD, METAL-FOIL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/124158
Kind Code:
A1
Abstract:
A prepreg according to the present invention includes a thermosetting resin, a filler, and a substrate in order to provide a prepreg, a laminated board, a metal-foil-clad laminated board, a printed wiring board, and a multilayer printed wiring board that are capable of adequately reducing warpage (achieving low warpage) in printed wiring boards, and particularly multilayer printed wiring boards without having a distinct glass transition temperature (Tg-less). In addition, a cured article obtained by thermosetting the prepreg at 230°C for 100 minutes satisfies the following equations (1) to (5).
E'(200°C)/E'(30°C) ≤ 0.90…(1)
E'(260°C)/E'(30°C) ≤ 0.85…(2)
E'(330°C)/E'(30°C) ≤ 0.80…(3)
E''max/E'(30°C) ≤ 3.0%…(4)
E''min/E'(30°C) ≥ 0.5%…(5)
(E': storage elastic modulus, E'' loss modulus, E'': loss modulus)
Inventors:
HAMAJIMA TOMOKI (JP)
YAMAGUCHI SHOHEI (JP)
KUBO TAKASHI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
YAMAGUCHI SHOHEI (JP)
KUBO TAKASHI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
Application Number:
PCT/JP2017/046840
Publication Date:
July 05, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08J5/24; B32B15/08; H05K1/03
Domestic Patent References:
| WO2017187783A1 | 2017-11-02 | |||
| WO2018016527A1 | 2018-01-25 |
Foreign References:
| JP2015157467A | 2015-09-03 | |||
| JP2015089622A | 2015-05-11 | |||
| JP2016196549A | 2016-11-24 | |||
| JPH1072752A | 1998-03-17 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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