Title:
PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/080195
Kind Code:
A1
Abstract:
The present invention pertains to: a prepreg which contains a fiber base material and a resin composition containing (A) a thermosetting resin and (B) a spherical zinc molybdate, and in which the weight per unit area of the fiber base material is 50 g/m2 or more; and a laminated plate, a printed wiring board, and a semiconductor package, in all of which the prepreg is used.
Inventors:
SAKAMOTO NORIHIKO (JP)
SUTOU KYOUSUKE (JP)
SUNAIRI YOSHIYA (JP)
SHIMAOKA SHINJI (JP)
SUTOU KYOUSUKE (JP)
SUNAIRI YOSHIYA (JP)
SHIMAOKA SHINJI (JP)
Application Number:
PCT/JP2023/036144
Publication Date:
April 18, 2024
Filing Date:
October 04, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08J5/10; C08K3/105; C08K3/11; C08L63/00; C08L79/00; C08L101/00; H05K1/03
Domestic Patent References:
| WO2021192680A1 | 2021-09-30 | |||
| WO2011078339A1 | 2011-06-30 | |||
| WO2010110433A1 | 2010-09-30 | |||
| WO2023145471A1 | 2023-08-03 |
Foreign References:
| JP2013010860A | 2013-01-17 | |||
| JP2013010861A | 2013-01-17 | |||
| JP2001113628A | 2001-04-24 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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