PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

Title:

PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2011/152413

Kind Code:

A1

Abstract:

The disclosed prepreg comprises a base material impregnated with a resin composition. Said resin composition contains: aluminum hydroxide with a mean particle diameter between 2.5 and 4.5 µm; and a glass filler with a mean particle diameter between 1.0 and 3.0 µm, a specific gravity between 2.3 and 2.6 g/cm³, and a SiO2 content between 50% and 65% by mass. The aluminum hydroxide and glass filler constitute a total of between 30% and 50% of the total solid mass of the resin composition. Using this prepreg, despite the use of aluminum hydroxide in parallel with an inorganic filler such as silica, a highly-workable metal-clad laminate with a low coefficient of thermal expansion and an inorganic filler uniformly dispersed therein can be produced.

Inventors:

GOUZU SHUUJI (JP)
YANAGIDA MAKOTO (JP)

Application Number:

PCT/JP2011/062517

Publication Date:

December 08, 2011

Filing Date:

May 31, 2011

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)
GOUZU SHUUJI (JP)
YANAGIDA MAKOTO (JP)

International Classes:

C08L63/00; B32B15/08; C08G59/62; C08J5/24; C08K3/20; C08K3/40; H05K1/03

Domestic Patent References:

WO2008140059A1	2008-11-20
WO2009070488A1	2009-06-04
WO2010106698A1	2010-09-23

Foreign References:

JP2004182850A	2004-07-02
JPH07206983A	1995-08-08
JP2007535600A	2007-12-06
JP2001261933A	2001-09-26
JP2004269727A	2004-09-30
JP2010031263A	2010-02-12
JP2009074036A	2009-04-09
JP2009155398A	2009-07-16

Other References: