Title:
PREPREG, METAL-FOIL-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2012/132923
Kind Code:
A1
Abstract:
Provided are: a prepreg which has a low water-absorbing rate, rarely undergoes the deterioration in insulation resistance over time, and also has excellent heat resistance; a metal-foil-cladded laminate board produced using the prepreg; a printed wiring board produced using the metal-foil-cladded laminate board; and others. This prepreg is produced by impregnating a base (D) with a resin composition or applying the resin composition onto the base (D), wherein the resin composition comprises (A) a naphthol-modified dimethylnaphthalene formaldehyde resin, (B) an epoxy resin having an epoxy equivalent of 200-400 g/eq. and (C) an inorganic filler.
Inventors:
ARII KENJI (JP)
NOMIZU KENTARO (JP)
SOGAME MASANOBU (JP)
NOMIZU KENTARO (JP)
SOGAME MASANOBU (JP)
Application Number:
PCT/JP2012/056673
Publication Date:
October 04, 2012
Filing Date:
March 15, 2012
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
ARII KENJI (JP)
NOMIZU KENTARO (JP)
SOGAME MASANOBU (JP)
ARII KENJI (JP)
NOMIZU KENTARO (JP)
SOGAME MASANOBU (JP)
International Classes:
C08J5/24; B32B15/08; B32B15/092; C08G10/04; C08G59/62; H05K1/03
Domestic Patent References:
WO2003055927A1 | 2003-07-10 |
Foreign References:
JP2009155638A | 2009-07-16 | |||
JP2004091550A | 2004-03-25 | |||
JP2011037993A | 2011-02-24 | |||
JP2000119369A | 2000-04-25 | |||
JP2004123859A | 2004-04-22 | |||
JP2009001812A | 2009-01-08 | |||
JP2009108147A | 2009-05-21 | |||
JP2009155638A | 2009-07-16 |
Other References:
See also references of EP 2692784A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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Claims:
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