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Title:
PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/002434
Kind Code:
A1
Abstract:
Provided is a prepreg which can accommodate a thickness reduction and in which different applications, functions, performances, characteristics, or the like can be imparted respectively to the two surfaces thereof. One of the surfaces of the prepreg has excellent adhesion to a conductor layer, and a fine circuit can be formed thereon. The prepreg comprises a core layer equipped with a fibrous base, a first resin layer, and a second resin layer and further includes a carrier film laminated to the surface of the first resin layer and/or the surface of the second resin layer. The prepreg is characterized in that the first resin layer is a layer comprising a first epoxy resin composition which comprises silica nanoparticles having an average particle diameter of 1-100 nm, a thermoplastic resin, and an epoxy resin, the first resin layer being in contact with the fibrous base or some of the first resin layer having been infiltrated into the fibrous base, and that the second resin layer comprises a second epoxy resin composition which comprises an inorganic filler and an epoxy resin, some of the second resin layer having been infiltrated into the fibrous base.

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Inventors:
OHIGASHI Noriyuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
大東　範行 (〒02 東京都品川区東品川２丁目５番８号　住友ベークライト株式会社内 Tokyo, 〒1400002, JP)
Application Number:
JP2011/064913
Publication Date:
January 05, 2012
Filing Date:
June 29, 2011
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
OHIGASHI Noriyuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
International Classes:
C08J5/24; B32B5/28; B32B27/12; H05K1/03
Attorney, Agent or Firm:
TANAI Sumio et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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Claims:



 
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