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Title:
PRESS-FIT TERMINAL CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/199846
Kind Code:
A1
Abstract:
The objective of the invention is to provide a press-fit terminal connection structure in which a circuit board connection portion from a press-fit terminal is connected by being press-fitted into a through-hole provided on a printed circuit board, the press-fit terminal connection structure being capable of simultaneously improving the holding force for maintaining the press-fit terminal in an inserted state in the through-hole, and, when inserting and removing the press-fit terminal with respect to the through-hole, suppressing the scraping of the surface layer and reducing the load needed for the insertion and removal. This press-fit terminal connection structure comprises: the press-fit terminal having an alloy-containing layer 2c at least on a contact portion surface; and the through-hole having a tin layer 3c on the outermost surface of the inner peripheral surface including at least a contact portion. The alloy-containing layer 2c contains alloy portions 2c1, each comprising an alloy having tin and palladium as main components, and a tin portion 2c2 comprising pure tin or an alloy wherein the proportion of tin with respect to palladium is higher than that in each of the alloy portions 2c1. Domain structures from the alloy portions 2c1 are present in the tin portion 2c2, and some of the alloy portions 2c1 and the tin portion 2c2 both are exposed on the outermost surface of the alloy-containing layer 2c.

Inventors:
SHIRAI YOSHIMASA (JP)
SAITOH YASUSHI (JP)
FURUKAWA KINGO (JP)
KAWASAKI TETSUHIKO (JP)
OOKUBO MASAYUKI (JP)
WATANABE HAJIME (JP)
TSUCHIYA YOSHIYASU (JP)
KATO AKIHIRO (JP)
Application Number:
PCT/JP2017/017864
Publication Date:
November 23, 2017
Filing Date:
May 11, 2017
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/58; H01R13/03; C25D5/10; C25D7/00
Domestic Patent References:
WO2011125747A12011-10-13
WO2008038331A12008-04-03
Foreign References:
JP2016018726A2016-02-01
JP2012248423A2012-12-13
JP2007122952A2007-05-17
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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