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Title:
PRESSING DEVICE AND RESIN SHEET CURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/015956
Kind Code:
A1
Abstract:
This pressing device is for pressing a laminate provided with a substrate, an optical semiconductor element mounted on the substrate, a resin sheet formed on the substrate from a thermosetting resin so as to cover the optical semiconductor element, and a release sheet arranged on the resin sheet. This pressing device is provided with a lower plate on which the laminate is placed with the substrate down and the release sheet up, an upper plate configured to press the laminate from the top towards the bottom, and a first spacer configured to be positioned between the lower plate and the upper plate. The first spacer is configured such that in the vertical direction, the upper end of said first spacer is positioned below the upper end of the release sheet of the laminate.

Inventors:
KITAYAMA YOSHIHIKO (JP)
Application Number:
PCT/JP2014/066703
Publication Date:
February 05, 2015
Filing Date:
June 24, 2014
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C43/18; B30B7/02; B30B15/02; B30B15/34; H01L21/56; H01L33/52
Foreign References:
JP2013131552A2013-07-04
JP2002001588A2002-01-08
JPH08501991A1996-03-05
JP2009099850A2009-05-07
JPH1058534A1998-03-03
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
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