PRESSING HEAD FOR FLIP-CHIP BONDING APPARATUS AND PRESSING ASSEMBLY COMPRISING SAME

WIPO Patent Application WO/2018/074698

A1

A pressing head of the present invention has a suction line, connecting to a suction hole, formed on the floor side of a suction module, which is produced from a base material transmitting a laser beam, by means of a polishing process and thus stably draws in and presses a flip chip by means of the suction hole and the suction line and shows increased light transmittance, thereby enabling a decrease in the loss of the laser beam, which is required for flip-chip bonding, as well as acquisition of a homogenized planar light source. And since the pressing head is produced such that an upper fixing bracket, a suction module bracket and a lower fixing bracket are sequentially coupled by means of a coupling member so as to be attached and detached, the lower fixing bracket, the suction module and the suction module bracket can sequentially be disassembled simply by means of disassembling the coupling member, and thus the time for replacing components can be reduced and the overall working time for the flip-chip bonding and the amount of completed flip-chip bonding can be increased.

CHOI JAE JOON (KR)
PARK CHANG YONG (KR)
KIM KI SUK (KR)
KIM BYUNG ROCK (KR)

PCT/KR2017/006599

April 26, 2018

June 22, 2017

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CRUCIALMACHINES CO LTD (KR)

F21V8/00; G02B27/30; H01L21/677; H01S5/026

KR20150068890A	2015-06-22
KR101126762B1	2012-03-29
KR20140141430A	2014-12-10
KR20080095375A	2008-10-29
KR20080094131A	2008-10-23

KIM, Tae Soo (KR)

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