Title:
PRESSURE BONDING SHEET AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/224073
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a pressure bonding sheet which demonstrates excellent adhesion properties with respect to an adherend even when pressurized at a low-pressure zone (for example, 0.1-3.0 MPa); and a production method therefor. A pressure bonding sheet according to the present invention has a substrate and a surface layer comprising microcapsules, wherein: the aggregation rate of the microcapsules found when observed from the direction normal to the surface layer is 1-18; the average particle diameter of the microcapsules is larger than the average thickness of the surface layer at a location where none of the microcapsules are present; and the surface layer comprises a compound A and a compound B which undergoes a curing reaction with the compound A or which cures the compound A, and satisfies requirement 1 or requirement 2, or the surface layer comprises a compound A, a compound C1, and a compound C2, and satisfies requirement 3 or requirement 4. Upon reacting with the compound C2, the compound C1 generates a compound B which cures the compound A.
Inventors:
HATTA MASAHIRO (JP)
ARIOKA DAISUKE (JP)
TAKASAKI YUTA (JP)
SAITOU TAKASHI (JP)
ARIOKA DAISUKE (JP)
TAKASAKI YUTA (JP)
SAITOU TAKASHI (JP)
Application Number:
PCT/JP2023/018455
Publication Date:
November 23, 2023
Filing Date:
May 17, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B01J13/16; C09J7/20; C09J7/38; C09J11/06; C09J163/00; C09J175/04; C09J201/00; C09J201/02
Foreign References:
| JPH0711211A | 1995-01-13 | |||
| JP2000017246A | 2000-01-18 | |||
| JPS63268783A | 1988-11-07 | |||
| JPH0410304A | 1992-01-14 | |||
| JP2007091862A | 2007-04-12 | |||
| JPH1135897A | 1999-02-09 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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