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Patent Searching and Data


Title:
PRESSURE BONDING-TYPE ADHESIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/043756
Kind Code:
A1
Abstract:
Provided is a pressure bonding-type adhesive member comprising a support body 1, a first adhesive layer 2 formed on one surface of the support body, and a second adhesive layer 3 formed on the other surface of the support body. The pressure bonding-type adhesive member is characterized in that the second adhesive layer 3 comprises a main body layer 3A and a plurality of protrusions 3B provided on the surface of the main body layer, and in that the adhesive strength of the first adhesive layer 2 is greater than the adhesive strength of the second adhesive layer 3.

Inventors:
DOI ASAMI (JP)
TAKAHASHI AKIKO (JP)
CHIBA MIZUHO (JP)
SHIMOKITA KEISUKE (JP)
OOTAKE HIRONAO (JP)
Application Number:
PCT/JP2017/031985
Publication Date:
March 08, 2018
Filing Date:
September 05, 2017
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J121/00; C09J133/00; C09J183/04; E04F13/07
Domestic Patent References:
WO2016143731A12016-09-15
WO2017065275A12017-04-20
Foreign References:
JP2002121503A2002-04-26
JPH09227843A1997-09-02
JPH07102223A1995-04-18
JP2015052060A2015-03-19
JPH07206234A1995-08-08
JPH07278504A1995-10-24
JP2016173045A2016-09-29
Other References:
See also references of EP 3508543A4
Attorney, Agent or Firm:
TAKASHIMA, Hajime et al. (JP)
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