Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRESSURE BONDING-TYPE ADHESIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/043757
Kind Code:
A1
Abstract:
Provided is a pressure bonding-type adhesive member comprising a support body 1, a first adhesive layer 2 formed on one surface of the support body 1, and a second adhesive layer 3 formed on the other surface of the support body 1. The pressure bonding-type adhesive member is characterized in that the second adhesive layer 3 comprises a main body layer 3A and a plurality of protrusions 3B provided on the surface of the main body layer 3A, and in that the adhesive strength of the second adhesive layer 3 is greater than the adhesive strength of the first adhesive layer 2.

Inventors:
DOI, Asami (1-2 Shimohozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
TAKAHASHI, Akiko (1-2 Shimohozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
CHIBA, Mizuho (1-2 Shimohozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
SHIMOKITA, Keisuke (1-2 Shimohozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
OOTAKE, Hironao (1-2 Shimohozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2017/031986
Publication Date:
March 08, 2018
Filing Date:
September 05, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTO DENKO CORPORATION (1-2 Shimohozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
C09J5/00; C09J121/00; C09J133/04; C09J183/04; E04F13/07
Domestic Patent References:
WO2016143731A12016-09-15
WO2017065275A12017-04-20
Foreign References:
JPS4942167U1974-04-13
JP2002121503A2002-04-26
JPH09227843A1997-09-02
Attorney, Agent or Firm:
TAKASHIMA, Hajime et al. (Meiji Yasuda Seimei Osaka Midosuji Bldg, 1-1 Fushimimachi 4-chome, Chuo-ku, Osaka-sh, Osaka 44, 〒5410044, JP)
Download PDF: