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Patent Searching and Data


Title:
PRESSURE-BONDING-TYPE METALLIC DECORATIVE PLATE, METALLIC DECORATIVE PLATE, AND METHODS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2011/067851
Kind Code:
A1
Abstract:
Disclosed is a pressure-bonding-type metallic decorative plate comprising a metallic decorative pattern having an approximately same shape as a surface intended for bonding that is formed on an attachment surface, and a bonding/affixing layer configured from a pressure-sensitive double-sided bonding tape for bonding and affixing the metallic decorative pattern to the surface intended for bonding on the bottom surface of the metallic decorative pattern, said pressure bonding-type metallic decorative plate being characterized in that the pressure-sensitive double-sided bonding tape is cut so as to have a same shape as the metallic decorative pattern or be smaller than the metallic decorative pattern by 5-400 μm by a laser beam or by press working with a peeling layer being left. Consequently, the metallic decorative pattern can be stably held on a support for a long period, and the step for bonding the same can be facilitated.

Inventors:
MIURA HIDEKATSU (JP)
NAKAYAMA HAJIME (JP)
Application Number:
PCT/JP2009/070385
Publication Date:
June 09, 2011
Filing Date:
December 04, 2009
Export Citation:
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Assignee:
TEFCO AOMORI CO LTD (JP)
MIURA HIDEKATSU (JP)
NAKAYAMA HAJIME (JP)
International Classes:
B44C1/14; B44C3/02; B23K26/55; B32B15/04; B44C1/22
Foreign References:
JP2006281652A2006-10-19
JP2005254301A2005-09-22
JP2004009258A2004-01-15
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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