Title:
PRESSURE RESISTANCE MEASURING APPARATUS AND PRESSURE RESISTANCE MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/112215
Kind Code:
A1
Abstract:
A pressure resistance measuring apparatus (100) is formed on a semiconductor substrate (200) and is used for measuring pressure resistance of a semiconductor device (210) having an electrode (222). A stage (120) is provided inside an airtight container (110) and is used for supporting the semiconductor substrate (200). A probe (130) is provided inside the airtight container (110), is constituted to be capable of moving relative to the stage (120), and is used for obtaining an electrical connection with the electrode (222) by contacting the electrode (222). An introduction part (140) is provided inside the airtight container (110) and is used for introducing gas into the airtight container (110). A discharge part (150) is provided inside the airtight container (110) and is used for discharging gas from the airtight container (110).
Inventors:
SAKAI MITSUHIKO (JP)
Application Number:
PCT/JP2013/081866
Publication Date:
July 24, 2014
Filing Date:
November 27, 2013
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/66; G01R31/26
Foreign References:
| JP2000164648A | 2000-06-16 | |||
| JP2006237059A | 2006-09-07 | |||
| JP2002158267A | 2002-05-31 | |||
| JP2003100819A | 2003-04-04 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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