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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/196434
Kind Code:
A1
Abstract:
The present invention relates to a pressure-sensitive adhesive composition containing a base polymer and at least one oligomer, the pressure-sensitive adhesive composition being characterized in that the oligomer is obtained by polymerizing a monomer composition containing at least a vinyl monomer having at least one pigment structure in a side chain.

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Inventors:
WATANABE KENTO (JP)
OZAKI MAYU (JP)
OKAMOTO MASAYUKI (JP)
HONDA SATOSHI (JP)
Application Number:
PCT/JP2020/012798
Publication Date:
October 01, 2020
Filing Date:
March 23, 2020
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; C09J7/38; C09J11/08; C09J133/00
Domestic Patent References:
WO2018110709A12018-06-21
Foreign References:
JPS60252672A1985-12-13
JP2008308646A2008-12-25
JP2015013946A2015-01-22
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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