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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET MAKING USE OF THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/097365
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of at least two cyclic molecules, the cyclic molecules having reactive groups, the linear-chain molecule at its both ends having block groups, and (B) adhesive polymer having two or more functional groups capable of reacting with the reactive groups, or a pressure-sensitive adhesive composition (A) polyrotaxane having a linear-chain molecule passing through opening portions of at least two cyclic molecules, the cyclic molecules having reactive groups, the linear-chain molecule at its both ends having block groups, (B’) adhesive polymer having two or more reactive groups and (C) compound having two or more functional groups capable of reacting with the reactive groups of the polyrotaxane (A) and the reactive groups of the polymer (B’). Thus, there can be provided a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer that excels in flexibility and exhibits high gel ratio and durability; and provided a pressure-sensitive adhesive composition for preparing of the pressure-sensitive adhesive layer.

Inventors:
ARAI, Takayuki (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
荒井 隆行 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 1730001, JP)
KASHIO, Mikihiro (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
Application Number:
JP2007/053197
Publication Date:
August 30, 2007
Filing Date:
February 21, 2007
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 1730001, JP)
リンテック株式会社 (〒01 東京都板橋区本町23番23号 Tokyo, 1730001, JP)
ARAI, Takayuki (23-23 Honcho, Itabashi-k, Tokyo 01, 1730001, JP)
荒井 隆行 (〒01 東京都板橋区本町23番23号 リンテック株式会社内 Tokyo, 1730001, JP)
International Classes:
C09J201/00; C09J4/00; C09J4/06; C09J7/00; C09J105/16; C09J109/00; C09J123/06; C09J123/12; C09J123/22; C09J133/08; C09J167/00; C09J171/00; C09J171/08; C09J179/02; C09J183/04; C09J201/02
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (Arcadia Patent Firm, Suite 501 Hikawa-Annex No.2, 9-5, Akasaka 6-chom, Minato-ku Tokyo, 107-0052, JP)
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