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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/047860
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive composition containing: a (meth)acrylic ester polymer (A) including, as a monomer unit forming the polymer, an ethylene-carbonate-containing monomer having the ethylene carbonate structure represented by formula (1); an ionic compound (B); and an active-energy-ray-curable component (C). A pressure-sensitive adhesive, pressure-sensitive adhesive sheet, and laminate obtained from said pressure-sensitive adhesive composition have excellent conformability to unevenness and make it possible to suppress the occurrence of optical irregularities.

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Inventors:
NAKANISHI MINAMI (JP)
NANASHIMA YUTAKA (JP)
Application Number:
PCT/JP2022/031378
Publication Date:
March 30, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/06; C08F220/28; C09J7/38; C09J133/04; C09J133/14
Domestic Patent References:
WO2021132693A12021-07-01
WO2021225038A12021-11-11
WO2021192423A12021-09-30
Foreign References:
JP2005036081A2005-02-10
US6593412B12003-07-15
JP2010097070A2010-04-30
JP2020196828A2020-12-10
JP2019172932A2019-10-10
JP2022024597A2022-02-09
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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