Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/220498
Kind Code:
A1
Abstract:
The present application may provide a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer that is applied to a flexible device to effectively cope with repeated deformation and recovery, does not cause defects (for example, deformation marks are observed and the like) before and after deformation, has excellent cutability and workability, does not cause lifting, peeling, and/or bubbles, and exhibits a level of transmittance that can omit a polarizing plate.
Inventors:
RYU SEUNG YEON (KR)
KIM HYUN CHEOL (KR)
LEE YEON KEUN (KR)
KIM JI YOUNG (KR)
KIM HYUN CHEOL (KR)
LEE YEON KEUN (KR)
KIM JI YOUNG (KR)
Application Number:
PCT/KR2022/005111
Publication Date:
October 20, 2022
Filing Date:
April 15, 2022
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C09J9/00; C09J11/00; C09J133/04
Foreign References:
| KR20190069333A | 2019-06-19 | |||
| KR20200119340A | 2020-10-19 | |||
| KR20160065030A | 2016-06-08 | |||
| KR20180030747A | 2018-03-26 | |||
| KR20170078510A | 2017-07-07 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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