PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD

Title:

PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD

Document Type and Number:

WIPO Patent Application WO/2012/036209

Kind Code:

A1

Abstract:

The purpose of the present invention is the provision of: a pressure-sensitive adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed by the application of light even after having undergone a high-temperature process at a temperature of 200°C or higher; a pressure-sensitive adhesive tape using said pressure-sensitive adhesive compound; and a wafer treatment method using said pressure-sensitive adhesive compound. The present invention is a pressure-sensitive adhesive compound that contains: a pressure-sensitive adhesive component, a photopolymerization initiator, and a silicone compound that has a functional group that can crosslink the pressure-sensitive adhesive component.

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Inventors:

TONEGAWA TORU (JP)
ASAO TAKAHIRO (JP)
SUMII YUICHI (JP)
NOMURA SHIGERU (JP)
FUKUOKA MASATERU (JP)
SUGITA DAIHEI (JP)

Application Number:

PCT/JP2011/071004

Publication Date:

March 22, 2012

Filing Date:

September 14, 2011

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)
TONEGAWA TORU (JP)
ASAO TAKAHIRO (JP)
SUMII YUICHI (JP)
NOMURA SHIGERU (JP)
FUKUOKA MASATERU (JP)
SUGITA DAIHEI (JP)

International Classes:

C09J201/00; C09J5/06; C09J7/38; C09J133/06; C09J183/07; H01L21/02

Foreign References:

JP2009132867A	2009-06-18
JP2010132755A	2010-06-17
JPH10306274A	1998-11-17
JP2004083646A	2004-03-18
JP2009245989A	2009-10-22
JP2000044890A	2000-02-15
JPH01249878A	1989-10-05
JPH0532946A	1993-02-09
JPH0532946A	1993-02-09
JP2008280505A	2008-11-20

Other References: